Chip Mounting Machine


This equipment can support numerous bonding technologies, including adhesive, soldering, thermocompression and ultrasonic. Overlay vision alignment system (VAS) with fixed beam splitter can complete the accurate visual alignment between chip and substrate. The high-definition camera helps to confirm the soldering quality quickly. The substrate of the equipment is 150mm×150mm . The component size that the equipment support is from 0.03mm×0.03mm to 20mm×20mm.


Device Name Chip Mounting Machine
Company Finetech
Model FINEPLACER® lambda 2
  • Sub-micron placement accuracy
  • Superior optical resolution
  • Numerous bonding technologies (adhesive, soldering, thermocompression, ultrasonic)
  • Data/media logging and reporting function
  • Wide range of controlled bonding forces
  • In-situ process observation in HD
  • Overlay vision alignment system (VAS) with fixed beam splitter
  • Sequence control with predefined parameters
  • Placement area: 150mm X 150mm
  • Placement accuracy: 1 μm

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