This equipment has the function of desoldering, placement, soldering and inspection. It has many emitters, a hybrid emitter on the top and 3 IR emitters on the bottom. They can heat the board at the same time to prevent the board from bending. The equipment is more suitable for devices that are difficult to weld manually, such as BGA, QFN packages. It can support the PCB size from 20mm×20mm to 382mm×300mm and the component size from 0.2mm×0.4mm to 70mm×70mm.
|Device Name||Hybrid Rework Station|