The fully automatic gold wire bonder is a modem micro-electronic wrapping equipment that utilizes interdisciplinary technologies such as fine mechanics, auto control, image recognition, optics, ultrasonic heat-pressing sealing and so on. The Eagle Aero revolutionizes wire bonding technology Capable of 30µm Bond Pad Pitch Proven Volume Production of <45 µm pad pitch.
| Device Name | Gold Wire Ball Bonder |
| Company | ASM |
| Model | Eagle-Aero |
| Characteristics |
|