Hui Wu

  • 2021 B.Eng. Fudan University



Hui Wu received the B.Eng. degree in microelectronics science and engineering from Fudan University, Shanghai, China, in 2021. He received outstanding undergraduate scholarships from Fudan University from 2018 to 2021. He joined the Center of Excellence in Biomedical Research on Advanced Integrated-on-chips Neurotechnologies (CenBRAIN Neurotech), School of Engineering, Westlake University, Hangzhou, China, in 2021, where he is currently pursuing his Ph.D. degree.  

Research Interests and Project 

Hui Wu is interested in low-power biomedical system-on-chip design and tests for wearable and implantable healthcare systems. He is now working on neural sensing front-end architectures for neural signal recording. The purpose of his projects is to design analog and mixed-signal integrated circuits for recording the electrical activity of neurons with high quality while these recordings are indispensable for understanding and diagnosing neurological disorders like epileptic seizures, in the creation of brain-machine interfaces, and for neuroprosthetic technologies to aid paralyzed patients. 

Representative Publications

[1] Jinbo Chen, Mahdi Tarkhan, Hui Wu, Fereidoon Hashemi Noshahr, Jie Yang, and Mohamad Sawan, “Recent Trends and Future Prospects of Neural Recording Circuits and Systems: A Tutorial Brief,” Accepted in IEEE transactions on circuits and systems II, 2022.

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