Biomedical lab


The fully automatic gold wire bonder is a modem micro-electronic wrapping equipment that utilizes interdisciplinary technologies such as fine mechanics, auto control, image recognition, optics, ultrasonic heat-pressing sealing and so on. The Eagle Aero revolutionizes wire bonding technology Capable of 30µm Bond Pad Pitch Proven Volume Production of <45 µm pad pitch.


Device Name Gold Wire Ball Bonder
Company ASM
Model Eagle-Aero
  • Ultra fine pitch
  • CMOS image sensor
  • Bond on active circuits
  • Multi-tier looping

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