Sub-Micron Table Top Die Bonder -sawan实验室

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Sub-Micron Table Top Die Bonder

Introduction

The table top flip chip bonder FINEPLACER® lambda 2 builds on its acclaimed predecessor to set new standards in precision die attach and advanced chip packaging for opto-electronic assemblies and more. The completely revised table top die bonding platform can be easily configured for a wide range of applications for process development or prototyping. Numerous process module options and in-field-retrofit capabilities guarantee maximum technological flexibility of the table top die bonder to protect your investment in the face of ever-changing challenges.

Characteristics

Device Name	Sub-Micron Table Top Die Bonder
Model	Finetech Lambda 2
Characteristics	- Sub-micron placement accuracy - Superior optical resolution - Excellent price performance ratio - Manual or semi-automatic machine versions - Individual configurations with process modules - Numerous bonding technologies (adhesive, soldering, thermocompression, ultrasonic) - Data/media logging and reporting function - Wide range of controlled bonding forces - Various bonding technologies in one recipe - Process module compatibility across Finetech platforms - Modular machine platform allows in-field retrofitting during entire service life - Synchronized control of all process related parameters - Overlay vision alignment system (VAS) with fixed beam splitter

Device Name

Sub-Micron Table Top Die Bonder

Model

Finetech Lambda 2

Characteristics

- Sub-micron placement accuracy

- Superior optical resolution

- Excellent price performance ratio

- Manual or semi-automatic machine versions

- Individual configurations with process modules

- Numerous bonding technologies (adhesive, soldering, thermocompression, ultrasonic)

- Data/media logging and reporting function

- Wide range of controlled bonding forces

- Various bonding technologies in one recipe

- Process module compatibility across Finetech platforms

- Modular machine platform allows in-field retrofitting during entire service life

- Synchronized control of all process related parameters

- Overlay vision alignment system (VAS) with fixed beam splitter