Wire Bonder-sawan实验室

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Wire Bonder

Introduction

The Eagle AERO is the pioneer product to be imbued with the now patented X-Power, thermosonic bonding technology in the wire bonding process, supported by the Aeroducer transducer that supports a dual frequency of X and Y direction. Built with great management software like AeroEye for smarter monitoring and quality assurance.

Characteristics

Device Name	Wire Bonder
Model	ASM Eagle-Areo
Characteristics	- Overall Dimension: W: 990mm D: 1760mm H: 1200mm - Weight: 800Kg - Voltage: 100V ~ 240V - Frequency: 50Hz ~ 60Hz - Power Consumption: 1500W - Compressed Air: Minimum 5 BAR, 150 LPM, Inlet Tube O.D. 12mm - Program Management: Remote Upload/Download, Bonding Parameter Checking - Host communication via SECS/GEM Protocol: Host communication via HSMS, SEGS/GEM, compatible Bonding program management, data upload, Bonding parameter check and wire layout check. - Bonding method: Thermal ultrasound with X Power - Wire Size: 0.5 ~ 2.0mil - Wire Length: 0.2 - 8mm - Bonding Speed: 24 wires/minute for 2mm - Bonding Accuracy: 2.0µm @ 3 sigma - Soldering Area: 56mm x 90mm (Leadframe Width <=100mm) - PR accuracy: 0.3 µm (high mag) - Lead wire positioner probing: 2 ms per lead wire - Line radian control: Fully programmable - Number of Bonding lines: up to 10000 for Step Repeat Matrix - Program storage 30,000 hard disk programs - Suitable Box L: 140 - 305mm H: 180mm (max) W: 32 - 115mm - Suitable Lead Frame L: 140 - 300mm T: 0.1 - 0.8mm W: 28 - 105mm - Box Pitch: 2.4 - 10mm Programmable - Number of buffer cassettes: 2 - 3

Device Name

Wire Bonder

Model

ASM Eagle-Areo

Characteristics

- Overall Dimension: W: 990mm D: 1760mm H: 1200mm

- Weight: 800Kg

- Voltage: 100V ~ 240V

- Frequency: 50Hz ~ 60Hz

- Power Consumption: 1500W

- Compressed Air: Minimum 5 BAR, 150 LPM, Inlet Tube O.D. 12mm

- Program Management: Remote Upload/Download, Bonding Parameter Checking

- Host communication via SECS/GEM Protocol: Host communication via HSMS, SEGS/GEM, compatible Bonding program management, data upload, Bonding parameter check and wire layout check.

- Bonding method: Thermal ultrasound with X Power

- Wire Size: 0.5 ~ 2.0mil

- Wire Length: 0.2 - 8mm

- Bonding Speed: 24 wires/minute for 2mm

- Bonding Accuracy: 2.0µm @ 3 sigma

- Soldering Area: 56mm x 90mm (Leadframe Width <=100mm)

- PR accuracy: 0.3 µm (high mag)

- Lead wire positioner probing: 2 ms per lead wire

- Line radian control: Fully programmable

- Number of Bonding lines: up to 10000 for Step Repeat Matrix

- Program storage 30,000 hard disk programs

- Suitable Box L: 140 - 305mm H: 180mm (max) W: 32 - 115mm

- Suitable Lead Frame L: 140 - 300mm T: 0.1 - 0.8mm W: 28 - 105mm

- Box Pitch: 2.4 - 10mm Programmable

- Number of buffer cassettes: 2 - 3